Long Wave 640x512 12μm Thermal Imaging Module for Security Monitoring

 Long Wave 640x512 12μm Thermal Imaging Module for Security Monitoring 

TWIN612 thermal module is a new arrival product developed by Global Sensor Technology. It integrates 640×512/12µm ceramic package uncooled infrared detector. With typical NETD＜40mk, the TWIN612 thermal module could present clearer, sharper and more detailed image.

With temperature measurement range of -20℃~150℃/0~550℃, accuracy of ±2℃ or ±2% and frame rate up to 30Hz, the thermal module guarantees smooth thermal image and accurate temperature measurement.

The TWIN612 thermal module has the advantages of compact design, light weight structure and power consumption as low as 0.8w. With enhanced image algorithms and temperature measurement function, the TWIN612 thermal module presents more stable images and accurate temperature.

Ceramic packaging process is similar to metal packaging, which is a mature infrared detector packaging technology. Compared with metal packaging, the volume and weight of the packaged detector will be greatly reduced. Thus, the TWIN612 thermal module could be applied to industries that have strict requirements on size, weight and power consumption.

- Mini Size: 25.4mm×25.4mm×35mm
- Light Weight: 25g
- Typical NETD<40mk
- Sharp, Clear Thermal Imaging
- Typical Power Consumption as Low as 0.8W

 
The TWIN612/R thermal imaging module is applied to the field of Thermography, Security Monitoring, UAV Payloads, Robots, Intelligent Hardware, ADAS, Firefighting & Rescue
 

1.What is infrared detector / thermal imaging sensor?

Infrared waves cannot be seen with the human eye. Infrared detector / thermal imaging sensor is an optical-electrical device to react to infrared radiation and thermal energy and convert it into electrical signal and then output visible thermal images.

2.What is WLP?

WLP refers to wafer level package. It is the process of completing high vacuum packaging directly on the entire MEMS wafer, then scribing and cutting to make a single infrared sensor. Together with metal package, ceramic package, they are the 3 main package formats of uncooled infrared detectors.

3. What is the difference between wafe level package, ceramic package and metal package?

Uncooled infrared detectors are currently divided into metal packaging, ceramic packaging, and wafer-level packaging. Metal packaging is the earliest and the best among the three main packaging forms; wafer-level packaging is suitable for mass production; and the ceramic packaging is more favored by the dedicated market for civilian products.